Semiconductor AX8300MAX Unicomp QFN Internal Void Defect Analyzer Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive ...

Unicomp X-ray foreign object inspection machine scan metal for chicken legs UNX3015 Product Description: Our advanced X-ray technology for contaminant detection within packaged foods has ushered in a new era of quality assurance, encompassing a diverse range of products from ready-to-eat meals and ...

CX300 Unicomp Gold Bond Inspection Equipment 90kV 5μm Resolution Bonding Wire Semiconductor X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, ...

Desktop Offline Real Time X-Ray Machine High Precision For Electronics Components​ OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can ...