Unicomp Concludes Rewarding 14th ECNDT 2026 Participation in Verona | Secures Custom NDT Equipment Order

NEWS

Unicomp Technology has completed its attendance at the 14th European Conference on Non-Destructive Testing (ECNDT 2026), hosted at Veronafiere Conference Centre between June 15 and 19. Stationed at Booth 377, Hall 12, the brand engaged with hundreds of European NDT specialists, manufacturers and industry partners against the landmark Verona Arena.

As a global specialist in AI-enabled industrial X-ray and CT non-destructive testing solutions, Unicomp presented its complete portfolio of intelligent inspection hardware and imaging technology. The booth showcased the brand’s core strength: high-resolution penetrative imaging that reveals hidden internal flaws, catering to complex quality control requirements spanning semiconductors & advanced packaging, new energy batteries, automotive cast components, photovoltaic modules and precision plastic & ceramic parts.

Over the four-day trade show, Unicomp’s cross-functional technical and sales team held extensive closed-door consultations with regional distributors and end-product manufacturers. Team members shared technical insights addressing widespread industry bottlenecks, including micro-scale interconnect defect identification, overlapping 3D structural interference, low-contrast flaw recognition and high-density component inspection challenges. Attendees showed strong interest in Unicomp’s self-developed core ray source technology, full-range component ecosystem and end-to-end intelligent inspection capability.

A major milestone achieved onsite was the confirmation of a formal order for a fully custom non-standard NDT inspection system with a local European manufacturer. Custom-built to match the client’s exclusive high-precision casting production workflows, the tailored system incorporates multi-angle tilted acquisition, AI-powered image enhancement and advanced noise suppression algorithms to resolve intricate detection tasks unfit for standard off-the-shelf equipment. This deal stands as clear market validation of Unicomp’s flexible custom R&D strength and reliable European customer support.

Boasting six global production and R&D hubs and a client network of over 1,300 leading automotive, energy and semiconductor enterprises worldwide, Unicomp significantly broadened its European partner ecosystem during the conference. Moving forward, the firm will keep innovating AI X-ray NDT technologies, deliver scalable full-process inspection platforms, and assist European advanced manufacturing players in elevating overall quality assurance standards.