دستگاه بازرسی اشعه ایکس الکترونیک AX7900 Unicomp 5μm Micro Focus Auto Void Detection BGA Solder دقت بالا
خواص اساسی
محل مبدا:
چین
نام تجاری:
UNICOMP
گواهینامه:
CE
شماره مدل:
AX7900
املاک تجاری
حداقل مقدار سفارش:
1set
قیمت:
can negotiate
شرایط پرداخت:
T/T، L/C
توانایی تامین:
300 مجموعه در هر ماه
محصولات مرتبط
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It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray -
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