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صفحه اصلی / محصولات / الکترونیک X Ray ماشین / Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor
کیفیت Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor کارخانه
کیفیت Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor کارخانه
کیفیت Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor کارخانه
کیفیت Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor کارخانه
کیفیت Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor کارخانه

Micro‑focus 2D 2.5D Imaging For PCBA QFP Defect Checking UNICOMP AX9100MAX Semiconductor

خواص اساسی
محل مبدا: چین
نام تجاری: UNICOMP
گواهینامه: CE, FDA
شماره مدل: AX9100max
املاک تجاری
حداقل مقدار سفارش: 1 مجموعه
قیمت: can negotiate
شرایط پرداخت: L/C، T/T
توانایی تامین: 30 ست در ماه
برچسب ها

x ray equipment,electronics x ray system,electronic inspection equipment

electronics x ray system

electronic inspection equipment
خلاصه محصول
AX9100MAX Semiconductor X-Ray Inspection System Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components with micro-focus 2D/2.5D imaging ...

جزئیات محصول

برجسته کردن:

Micro-focus 2D PCBA defect checking

,

2.5D imaging semiconductor X-ray machine

,

UNICOMP AX9100MAX QFP inspection
Machine Type: سیستم بازرسی اشعه ایکس الکترونیکی نیمه هادی
Model: AX9100max
Footprint: 1450(W)×1765(D)×1835(H)mm
Max.Power: 65 وات
X-Ray Tube Type: نوع مهر و موم شده
Pixel Size: 84μm
Pixel: 1536*1536
System Magnification: 1600X
توضیحات محصول
AX9100MAX Semiconductor X-Ray Inspection System Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components with micro-focus 2D/2.5D imaging technology. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive
امتیاز کلی
5.0
★★★★★
★★★★★
بر اساس 50 نظر اخیر
5 ستاره
100%
4 ستاره
0
3 ستاره
0
دو ستاره
0
۱ ستاره
0
تمام بررسی ها
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE

Mr. James Lee

Marketing Director

محصولات مرتبط

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